000 01840cam a2200349 a 4500
008 171201s1995 dcua b 101 0 eng
010 _a95-044669
020 _a0841233322
_q(acid-free paper)
035 _avtls001563509
035 _a2089474
039 9 _a201712011441
_bVLOAD
_y200505031539
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040 _aSTUSCHK1
_bslo
_cSTUSCHK1
082 0 0 _a621.381/046
_220
245 0 0 _aMicroelectronics technology :
_bpolymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 /
_cElsa Reichmanis ... [et al., editors].
260 _aWashington, DC
_bAmerican Chemical Society
_c1995.
300 _axii, 563 p.
_bill.
_c24 cm.
440 0 _aACS symposium series
_v614
504 _aIncludes bibliographical references and indexes.
650 0 _aMicroelectronic packaging
_xMaterials
_xCongresses.
650 0 _aPolymers
_xCongresses.
650 0 _aPhotoresists
_xCongresses.
700 1 _aReichmanis, Elsa,
_d1953-
710 2 _aAmerican Chemical Society.
_bDivision of Polymeric Materials: Science and Engineering
710 2 _aKobunshi Gakkai (Japan).
_bPolymers for Microelectronics Division.
710 2 _aAmerican Chemical Society.
_bMeeting
_n(209. :
_d1995 :
_cAnaheim, Calif.)
906 _a7
_bcbc
_corignew
_d1
_eocip
_f19
_gy-gencatlg
910 _aSCHK95
919 _a0-8412-3332-2
920 _a** LC HAS REQ'D # OF SHELF COPIES **
991 _bc-GenColl
_hTK7874
_i.M475 1995
_tCopy 1
_wBOOKS
999 _c8159
_d8159