Microelectronics technology :  polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 / 
Elsa Reichmanis ... [et al., editors]. 
 - Washington, DC  American Chemical Society  1995. 
 - xii, 563 p.  ill.  24 cm. 
 - ACS symposium series  614 .
<br/><br/>Includes bibliographical references and indexes. 
<br/><br/><label>ISBN: </label>0841233322 
<br/><br/><label>LCCN: </label>95-044669 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging--Materials--Congresses.<br/>Polymers--Congresses.<br/>Photoresists--Congresses.
<br/><br/><label>Dewey Class. No.: </label>621.381/046